논문 국내 국내전문학술지(KCI급) 새주소체계에 따른 우리나라 우편번호체계의 최적설계에 관한 연구
- 학술지 구분 국내전문학술지(KCI급)
- 게재년월 2009-11
- 저자명 차춘남,임준묵공동(교신),황은정,이성준
- 학술지명 한국SCM학회지
- 발행처명 한국SCM학회
- 발행국가 국내
- 논문언어 한국어
- 전체저자수 4
홈페이지논문 초록 (Abstract)
In this study, we investigated the characteristics of a nearly neutral Ni source solution including dimethylamine borane (DMAB) used to develop the metal PCB (printed circuit board) of high power LED (light-emitting diode), package. In accordance with the bath temperature ranging from 50 degrees C to 75 degrees C, an el ectroless Ni-B plating on a screen-printed Ag pattern with an anodized Al substrate was carried out. The depositon rate of the electro less plated Ni-B filmat bath temperature ranging from 50 C to 75 degree s C was estimated by measurements of the thickness and the mass. The deposition rates by change of thickness and mass of the electroless pla ted Ni-B film at 50 degrees C were similar to 58 nm/min and 0.113 mg/ min respectively. The activation energy obtained from slope of A rrhenius plot using these deposition rates was similar to 59 kJ/mol. Finally, selectively the film growth was achieved at all plating tem peratures, without a damage ofanodized Al substrate.