논문 국내 국내전문학술지(KCI급) Cu-Mg-P 합금의 기계적 성질과 전기전도도에 미치는 Ag첨가의 영향
- 학술지 구분 국내전문학술지(KCI급)
- 게재년월 2010-01
- 저자명 박준식,김정민공동(제1),김기태
- 학술지명 열처리공학회지
- 발행처명 한국열처리공학회
- 발행국가 국내
- 논문언어 한국어
홈페이지논문 초록 (Abstract)
The microstructure of Cu-Mg-P alloy sheet consisted of Cu matrix and very fine MgP precipitate, and it has been observed that the microstructure remains virtually unchanged by Ag additions up to 2%. Ag solutes were dissolved into the matrix and hardly found in the precipitates. The hardness increased with increase of the Ag content, whileas the conductivity slightly decreased. Strain hardening through cold rolling was found to be effective in improving the hardness, especially in high-Ag alloys. Aging treatment was conducted either before the first cold rolling or between the first and the final cold rolling, and the conductivity was significantly higher at the former case, regardless of the Ag content. Softening of Cu-Mg-P alloy sheet was remarkable above 400oC and the Ag content did not show any significant effect on it.