논문 국내 국내전문학술지(KCI급) Influence of P and Mg Additions on the Mechanical Properties and Electrical Conductivity of Cu-Sn Based Alloys
- 학술지 구분 국내전문학술지(KCI급)
- 게재년월 2007-12
- 저자명 Jeong-Min Kim† , Joon-Sik Park, and Ki-Tae Kim*
- 학술지명 열처리공학회지
- 발행처명 열처리공학
- 발행국가 국내
- 논문언어 한국어
- 전체저자수 3
홈페이지첨부 파일
논문 초록 (Abstract)
The high electrical conductivity Cu-0.15% Sn alloys containing various P contents, and the high conductivity and high strength Cu-0.1% Sn-0.1%Ag alloys with various Mg/P additions were fabricated and their mechanical properties and electrical conductivity were investigated. The electrical conductivity was generally decreased as the P content was increased where as the hardness and strength was shown to increase. When Mg was added to P-containing Cu alloys, the detrimental effect of P on the conductivity was significantly reduced, and TEM observations indicated that the formation of $Mg_3P_2$ phase is responsible for this result.