논문 해외 국제전문학술지(SCI급) Separation Characteristics of an LMPA–Polymer Mixture for the Encapsulation of Organic Light-Emitting Diode
- 학술지 구분 국제전문학술지(SCI급)
- 게재년월 2014-07
- 저자명 Hyun-Su Choi, Hye-Kyung Kwon, Keun-Soo Kim, Joon-Sik Park, and Choel-Hee Moon
- 학술지명 IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
- 발행처명 IEEE
- 발행국가 해외
- 논문언어 외국어
- 전체저자수 5
홈페이지
논문 초록 (Abstract)
An encapsulation method using the separation of low melting point alloy (LMPA) and a polymer from an LMPA-polymer mixture is proposed. Sn-Bi alloy and epoxy were used for the mixture. Separation was conducted using a two-step heat treatment of 160 °C for 5 min and 180 °C for 5 min. We found that the flux contained in the Sn-Bi solder played an important role in the separation process. A Cu sacrificial layer was introduced using the sputtering method under the Sn-Bi layer with thickness variations of 1500, 3000, and 6000 Å. Using the 6000-Å-thick Cu layer, the LMPA formed a well-separated and continuous sealing line. This double-line structure shows good potential for use as a sealing line for organic light-emitting diode encapsulation.