논문 해외 국제전문학술지(SCI급) Self-assembled bulk metallic glass composite prepared by electro discharge bonding technique
- 학술지 구분 국제전문학술지(SCI급)
- 게재년월 2007-02
- 저자명 J.S. Park a,b, J. Cho b, D.H. Kima, N.S. Lee c, K.B. Kimc, W.H. Lee c,∗
- 학술지명 Materials Science and Engineering A
- 발행처명 ELSEVIER
- 발행국가 해외
- 논문언어 외국어
- 전체저자수 6
홈페이지
논문 초록 (Abstract)
The bulk metallic glass (BMG) bonding with a thin elemental crystalline layer has been examined in terms of electro discharge technique. The estimated temperature rise during electro discharge was up to about 3500 °C, and thus the interface involved a liquid phase. When the optimized database was applied to fabricate the two-layered BMG (BMG/Zr/BMG), the interface between crystalline layer and BMG showed a well-bonded interface and the fracture toughness of the two-layered BMG exhibited higher value compared with monolithic BMG. The detailed calculation for input energy and the main mechanism for the higher toughness are discussed.