논문 해외 국제전문학술지(SCI급) Thermoforming 2D films into 3D electronics for high-performance, customizable tactile sensing
- 학술지 구분 국제전문학술지(SCI급)
- 게재년월 2025-05
- 저자명 Jungrak Choi, Chankyu Han, Donho Lee, Hyunjin Kim, Gihun Lee, Ji-Hwan Ha, Yongrok Jeong, Junseong Ahn, Hyunkyu Park, Hyeonseok Han, Seokjoo Cho, Jimin Gu, Inkyu Park
- 학술지명 Science Advances
- 발행처명 American Association for the Advancement of Science
- 발행국가 해외
- 논문언어 외국어
- 연구분야 공학 > 기계공학
- 원문 링크 https://www.science.org/doi/full/10.1126/sciadv.adv0057
홈페이지논문 초록 (Abstract)
The demand for tactile sensors in robotics, virtual reality, and health care highlights the need for high performance and customizability. Despite advances in vision-based technologies, tactile sensing remains crucial for precise interaction and subtle pressure detection. In this work, we present a design and fabrication method of customizable tactile sensors based on thermoformed three-dimensional electronics. This approach enables ultrawide modulus tunability (10 pascals to 1 megapascal) and superior mechanical properties, including negligible hysteresis and high creep resistance. These features allow the sensor to detect a broad spectrum of pressures, from acoustic waves to body weight, with high performance. The proposed sensors have high sensitivity (up to 5884 per kilopascal), high linearity (R2 = 0.999), low hysteresis (<0.5%), and fast response (0.1 milliseconds). We demonstrate applications in human-computer interaction and health care, showcasing their potential in various fields. This platform provides a scalable solution for fabricating versatile, high-performance tactile sensors.