논문 해외 국제전문학술지(SCI급) Pulse co-deposition of tin-silver alloy from citric acid plating bath for microelectronic applications
- 학술지 구분 국제전문학술지(SCI급)
- 게재년월 2019-11
- 저자명 정중희,Ashutosh Sharma,안병민
- 학술지명 MATERIALS RESEARCH EXPRESS
- 발행처명 IOP PUBLISHING LTD
- 발행국가 해외
- 논문언어 외국어
- 전체저자수 3
홈페이지논문 초록 (Abstract)
Sn?Ag alloys are gaining importance among microelectronics manufacturers because of their potential benefits, e.g., low melting point, excellent wetting to common metallic substrates, and superior mechanical properties required for microelectronic packaging devices. In this work, Sn?Ag alloy was co-deposited from acidic citric acid bath on copper substrates. The plating solution was composed of SnSO4, Ag2SO4, thiourea, and citric acid as a supporting electrolyte. Further, the influence of current density on the Ag content of the coatings was studied. The results indicate that the citric acid bath produces bright Sn?Ag deposits over a wide range of current densities. The grains of the deposits obtained were bigger at lower current densities (10?30 mA cm(?2)) and become finer at higher current densities (40?50 mA cm(?2)). Initially, the coatings were very hard and become soft as the current density increases gradually due to the decreased amount of Ag in the deposit which modified the coating solderability.