논문 해외 국제전문학술지(SCI급) Fe-Ni-Cr diffusion barrier for high-temperature operation of Bi2Te3
- 학술지 구분 국제전문학술지(SCI급)
- 게재년월 2023-01
- 저자명 오민욱,Park Sang Hyun,Kim Yeongseon,Jang Hanhwi,Hwang ChulHyun,Choi Jaejoon,Lee Ikjin
- 학술지명 JOURNAL OF ALLOYS AND COMPOUNDS
- 발행처명 ELSEVIER SCIENCE SA
- 발행국가 해외
- 논문언어 외국어
- 전체저자수 7
홈페이지논문 초록 (Abstract)
Bismuth-telluride (Bi2Te3)-based thermoelectric modules are widely used in practical applications at room temperature. However, to enable the utilization of waste heat sources, Bi2Te3-based thermoelectric modules need to operate at high efficiency levels over a medium temperature range (200-250 degrees C). To achieve high efficiency of Bi2Te3 modules operating at this temperature range, an optimal metallization layer should be inserted to minimize the electrical and thermal contact resistance and prevent elemental diffusion at the interface. In this work, we suggest a novel Fe-Ni-Cr layer to overcome the poor performance of the Ni layer, which is currently widely used as a metallization layer. The proposed Fe-Ni-Cr metallization resulted in a strong enough interface structure without any detachment even after thermal aging whereas the Ni-Cr metallization suffered from layer detachment problems. The specific electrical contact resistance of Fe-Ni-Cr metallization showed minor increase and remains at the similar to 10-5 Omega middotcm2 level after thermal aging at 250 celcius for 100 h. The reliability of the Fe-Ni-Cr metallization layer was demonstrated with a 32-couples ther-moelectric module, which showed a 5 % enhancement compared to Ni metallization thermoelectric module.(c) 2022 Elsevier B.V. All rights reserved.